Adhesive
SMT Red Glue
Red Glue (One-component Epoxy Resin Adhesive)
- Curing Mechanism: Cures rapidly after heating, starting at room temperature.
- Low-Temperature Stability: Maintains shape without drawing, overflowing, or collapsing—ideal for precise, high-speed, small-volume dispensing.
|
Item |
Specification |
|
Composition |
Epoxy resin |
|
Surface |
Red paste |
|
Proportion (Density) |
1.24 |
|
Dynamic Viscosity (25 °C, 5 rpm) |
300 Pa·s |
|
Thixotropic Index |
5.9 (1 rpm / 10 rpm) |
|
Adhesive Strength @ 125 °C |
44 N (45 kgf) 0.2 mg solder ball |
|
Volumetric Impedance Coefficient |
3.6 × 10¹⁶ Ω·cm (JIS K 9611) |
|
Insulation Resistance |
1.2 × 10¹⁴ Ω |
|
Initial Value |
1.2 × 10¹² Ω (JIS Z 3197) |
|
End Value |
— |
|
Dielectric Constant |
3.12 / 1 MHz (JIS K 9611) |
|
Dielectric Loss Factor |
0.012 / 1 MHz (JIS K 9611) |
|
Storage Condition |
Store below 5 °C |
|
Curing Condition |
150 °C for ≥120 s or 120 °C for ≥150 s |
