Adhesive Sealant & Lubricant
Shin Etsu KE-1204 A/B PottiEncapsulant Two-component liquid rubber
- High temperature resistance (up to 260C intermittent)
- Fast cure time
- UL 94 V-0 certified
- Dual component
- 1:1 mix ratio
- Heat cure
- Self-leveling
Product Description
Shin-Etsu's KE-1204 A/B is a UL 94 V-0 rated, dual component, heat cure, potting encapsulant that will form a durable, flexible rubber to protect electronic components. KE-1204 A/B exhibits excellent high temperature resistance, electrical isolation, and adhesion to printed circuit board substrates, metals, plastics, glass, and ceramics.
Typical Applications
Typical Properties
Note: Values are not for specification purposes.
Shin-Etsu's KE-1204 A/B is a UL 94 V-0 rated, dual component, heat cure, potting encapsulant that will form a durable, flexible rubber to protect electronic components. KE-1204 A/B exhibits excellent high temperature resistance, electrical isolation, and adhesion to printed circuit board substrates, metals, plastics, glass, and ceramics.
Typical Applications
- Protecting and electrically isolating electronic components
Typical Properties
| Type | Potting Encapsulant |
| Cure Type | Addition |
| One/Two Component | Two |
| UL Listing | Y |
| Low Molecular Weight Siloxane Stripped? | Y |
| Color | Reddish Brown |
| Density @ 23C (g/cm3) | 1.54 |
| Viscosity A (cps) | 6000 |
| Mix Ratio by weight | 100:100 |
| Cure Conditions | 15min @ 100C |
| Working Time | 8 Hours |
| Shore A Hardness | 70 |
| Tensile Strength (MPa) | 3.5 |
| % Elongation | 90 |
| Volume Resistivity (TΩ·m) | 2 |
| Dielectric Strength (kV/mm) | 27 |
| Dielectric Constant | 3.2 @ 50Hz |
| Dielectric Dissipation Factor | 1x10-3 @ 50Hz |
| Thermal Conductivity (W/m·K) | 0.3 |
| Usable Temperature Range (C) | -40 to +200 |
